If you like teardowns, this is an interesting one. Lot’s of detail on the take-apart, ultimately landing here:

By leaving the flip chip SoC in place and using IR imaging through the die’s backside to acquire a die image, the product remains functional. Now, it is time to see what can be learned from monitoring the M1 while it’s put through its paces on the lab bench

Looking forward to part two of this process.

[H/T Om Malik]